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Proceedings Paper

Reducing bubbles and particles associated with photoresist packaging materials and dispense systems
Author(s): W. B. Alexander; K. T. O'Dougherty; W. Liu; H. Yan; K. Mikkelsen
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Paper Abstract

A review of bubble energetics is presented to provide background into gas saturation and bubble formation in semiconductor resists. Nitrogen was used as a drive gas to push liquid out of several package materials versus a mechanical pump. The incorporation of dissolved gas was measured and a barrier liner was found to be superior versus a bottle with no liner. We have demonstrated that a pressure dispense package with an appropriate barrier liner provides a means to deliver lithographic chemicals and resist without the use of a mechanical pump.

Paper Details

Date Published: 2 April 2007
PDF: 7 pages
Proc. SPIE 6519, Advances in Resist Materials and Processing Technology XXIV, 651939 (2 April 2007); doi: 10.1117/12.712419
Show Author Affiliations
W. B. Alexander, ATMI, Inc. (United States)
K. T. O'Dougherty, ATMI, Inc. (United States)
W. Liu, ATMI, Inc. (United States)
H. Yan, ATMI, Inc. (United States)
K. Mikkelsen, ATMI, Inc. (United States)


Published in SPIE Proceedings Vol. 6519:
Advances in Resist Materials and Processing Technology XXIV
Qinghuang Lin, Editor(s)

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