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Proceedings Paper

Impact of curing kinetics and materials properties on imprint characteristics of resists for UV nano-imprint lithography
Author(s): Frances A. Houle; Ann Fornof; Ratnam Sooriyakumaran; Hoa Truong; Dolores C. Miller; Martha I. Sanchez; Blake Davis; Teddie Magbitang; Robert D. Allen; Mark W. Hart; Geraud Dubois
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Paper Abstract

UV curable resist formulations for nanoimprint must satisfy criteria for cure rate, volatility, viscosity, cohesion of the cured material and release from the template in addition to being successfully imprintable. We describe an investigation of the properties of a series of formulations comprising polyhedral oligomeric silsesquioxane and selected diluents as candidates for imprintable dielectrics. Although all have low viscosity and volatility and are successfully imprinted, significant variations in cure rate, mechanical and adhesion properties with resist composition are found. The trends observed are not all predictable from the literature, indicating that formulation optimization for this application requires a focus on the fundamentals of both materials and processes.

Paper Details

Date Published: 22 March 2007
PDF: 9 pages
Proc. SPIE 6519, Advances in Resist Materials and Processing Technology XXIV, 65191C (22 March 2007); doi: 10.1117/12.712298
Show Author Affiliations
Frances A. Houle, IBM Almaden Research Ctr. (United States)
Ann Fornof, IBM Almaden Research Ctr. (United States)
Ratnam Sooriyakumaran, IBM Almaden Research Ctr. (United States)
Hoa Truong, IBM Almaden Research Ctr. (United States)
Dolores C. Miller, IBM Almaden Research Ctr. (United States)
Martha I. Sanchez, IBM Almaden Research Ctr. (United States)
Blake Davis, IBM Almaden Research Ctr. (United States)
Teddie Magbitang, IBM Almaden Research Ctr. (United States)
Robert D. Allen, IBM Almaden Research Ctr. (United States)
Mark W. Hart, IBM Almaden Research Ctr. (United States)
Geraud Dubois, IBM Almaden Research Ctr. (United States)


Published in SPIE Proceedings Vol. 6519:
Advances in Resist Materials and Processing Technology XXIV
Qinghuang Lin, Editor(s)

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