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Proceedings Paper

Hot embossing of LCP using silicon master tool for short-distance optical interconnects
Author(s): Kamal Yadav; Scott R. Kirkpatrick; Azad Siahmakoun
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Proc. SPIE 6538, Sensors, and Command, Control, Communications, and Intelligence (C3I) Technologies for Homeland Security and Homeland Defense VI, 65381P; doi: 10.1117/12.712256
Show Author Affiliations
Kamal Yadav, Rose-Hulman Institute of Technology (United States)
Scott R. Kirkpatrick, Rose-Hulman Institute of Technology (United States)
Azad Siahmakoun, Rose-Hulman Institute of Technology (United States)


Published in SPIE Proceedings Vol. 6538:
Sensors, and Command, Control, Communications, and Intelligence (C3I) Technologies for Homeland Security and Homeland Defense VI
Edward M. Carapezza, Editor(s)

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