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Proceedings Paper

Initial process evaluation for next generation immersion technology node
Author(s): Tadatoshi Tomita; Kathleen Nafus; Shinichi Hatakeyama; Hitoshi Kosugi; Masashi Enomoto; Shin Inoue; Kirsten Ruck; Heiko Weichert; Mireia Blanco Mantecon; Raf Stegen; Casper de Groot; Richard Moerman
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Paper Abstract

In order to prepare for the next generation technology manufacturing, ASML and TEL are working together to investigate the process performance of the LITHIUSi+/ TWINSCAN XT:1700i lithocluster through decreasing critical dimension patterning. In this evaluation, process performance with regards to critical dimension uniformity and defectivity are compared at different critical dimensions in order to determine areas of concentration for equipment and process development. Specifically, design of experiments were run using immersion rinse processing at 60nm hp and 45nm hp. Defects were classified to generate a pareto for each technology node to see if there is any change in the defect types as critical dimensions are shrinking. Similarly, critical dimension uniformity was compared through technology nodes to see if any budget contributions have increased sensitivities to the smaller patterning features. Preliminary gauge studies were performed for the 45nm hp evaluation, as metrology at this design rule is not yet fully proven. More work is necessary to obtain complete understanding of metrology capabilities as this is crucial to discern precise knowledge of processing results. While preliminary results show no adverse impact moving forward, this work is a first screening of 45nm immersion processing and more work is needed to fully characterize and optimize the process to enable robust manufacturing at 45nm hp.

Paper Details

Date Published: 23 March 2007
PDF: 10 pages
Proc. SPIE 6519, Advances in Resist Materials and Processing Technology XXIV, 65192B (23 March 2007); doi: 10.1117/12.712206
Show Author Affiliations
Tadatoshi Tomita, Tokyo Electron Kyushu Ltd. (Japan)
Kathleen Nafus, Tokyo Electron Kyushu Ltd. (Japan)
Shinichi Hatakeyama, Tokyo Electron Kyushu Ltd. (Japan)
Hitoshi Kosugi, Tokyo Electron Kyushu Ltd. (Japan)
Masashi Enomoto, Tokyo Electron Kyushu Ltd. (Japan)
Shin Inoue, Tokyo Electron Europe Ltd. (Germany)
Kirsten Ruck, Tokyo Electron Europe Ltd. (Germany)
Heiko Weichert, Tokyo Electron Europe Ltd. (Germany)
Mireia Blanco Mantecon, ASML Netherlands B.V. (Netherlands)
Raf Stegen, ASML Netherlands B.V. (Netherlands)
Casper de Groot, ASML Netherlands B.V. (Netherlands)
Richard Moerman, ASML Netherlands B.V. (Netherlands)

Published in SPIE Proceedings Vol. 6519:
Advances in Resist Materials and Processing Technology XXIV
Qinghuang Lin, Editor(s)

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