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Proceedings Paper

Developing the new ADC algorithm that enables to identify the defect source
Author(s): Po-Yueh Tsai; Wen-Feng Chiu; To-Yu Chen; Fumiaki Endo; Yuko Kariya; Kazunori Nemoto
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Paper Abstract

Since the semiconductor manufacturing process has become more and more complicated due to the introduction of either new materials or new structures, detecting the source of a defect has become dramatically difficult. Automatic Defect Classification (ADC) is one of the most effective ways for identifying the source of a defect. However, the current ADC algorithm is insufficient in identifying a defect source, because its classification results are quite simple. Since the classification is determined by the shape or size of the defect, it is difficult to figure out the process or processing tool in which the defects are generated. To solve this problem, we propose a new ADC algorithm and have already applied it to a high-volume System-on-Chip (SoC) production line to verify its efficiency. We confirmed with the classification results that the new ADC algorithm is almost as accurate as manually classifying them, but with the reduction of the time required for identifying the defect source.

Paper Details

Date Published: 12 April 2007
PDF: 9 pages
Proc. SPIE 6518, Metrology, Inspection, and Process Control for Microlithography XXI, 65180P (12 April 2007); doi: 10.1117/12.712069
Show Author Affiliations
Po-Yueh Tsai, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Wen-Feng Chiu, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
To-Yu Chen, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Fumiaki Endo, Hitachi High-Technologies Corp. (Japan)
Yuko Kariya, Hitachi High-Technologies Corp. (Japan)
Kazunori Nemoto, Hitachi High-Technologies Corp. (Japan)

Published in SPIE Proceedings Vol. 6518:
Metrology, Inspection, and Process Control for Microlithography XXI
Chas N. Archie, Editor(s)

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