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Proceedings Paper

The study for increasing efficiency of OPC verification by reducing false errors from bending pattern by using different size of CD error non-checking area with various corner lengths
Author(s): Sang-Uk Lee; Yong-Suk Lee; Jeahee Kim; Keeho Kim
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Paper Abstract

In recent years, model based verification for optical proximity effect correction (OPC) has become one of the most important items in semiconductor industry. Major EDA companies have released various softwares for OPC verification. They have continuously developed and introduced new methods to achieve more accurate results of OPC verification. The way to detect only real errors by excluding false errors is the most important thing for accurate and fast verification process, because more time and human resource are needed to inspect the result of verification as increasing false errors. A major source of false errors is bending patterns. The number of those from bending patterns is over thousands and they are inevitable. The most verification tools have the scheme for excluding those by using CD error non-checking or filtering area. Real errors around bending pattern will not be able to detect with too big size of area, while too many false error will be reported with too small size of area. Since currently most verification tools had only a fixed area size for filtering, it has been impossible to achieve most accurate and efficient verification results. Through the optimization of area size with different corner length, we could get more accurate and efficient results and decrease the time for review to find real errors. In this paper, the suggestion in order to increase efficiency of OPC verification process by using different size of CD error non-checking area with various corner lengths is presented.

Paper Details

Date Published: 21 March 2007
PDF: 8 pages
Proc. SPIE 6521, Design for Manufacturability through Design-Process Integration, 65210S (21 March 2007); doi: 10.1117/12.711959
Show Author Affiliations
Sang-Uk Lee, Dongbu Electronics (South Korea)
Yong-Suk Lee, Dongbu Electronics (South Korea)
Jeahee Kim, Dongbu Electronics (South Korea)
Keeho Kim, Dongbu Electronics (South Korea)


Published in SPIE Proceedings Vol. 6521:
Design for Manufacturability through Design-Process Integration
Alfred K.K. Wong; Vivek K. Singh, Editor(s)

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