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Proceedings Paper

Application of enhanced dynamic fragmentation to minimize false error from post OPC verification
Author(s): Jae-Hyun Kang; Sang uk Lee; Jeahee Kim; Keeho Kim
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Paper Abstract

Conventional OPC fragmentation method operates under a set of simple guiding principles. All patterns are to be uniform in finite size from edge of polygon. Within each fragment, the intensity profile (aerial image) and edge-placement error (EPE) are calculated at a settled location. Finally, the length of the entire fragment is moved to correct for the EPE at that location. This is to be often against simulation like a model based OPC. In the strict sense, model based OPC is depended on simulation results not only moving of all fragments in the layout are reduced to zero but also dividing of all polygon edges. This drastically increased data volume and the computation time required to perform OPC. Therefore, more powerful fragmentation mechanism will be one of major factors for the success of OPC process. In this study, a new approach of fragmentation has been tested, which reduces OPC correction error. First, we check the weak point of all patterns using slope, EPE, MEEF and contrast. Second, weak points apply high frequency fragmentation based on simulation contour images. The others are divided into normal correction recipe. This improves to accurate OPC correction for weak point which can divide a fine classification. It also is possible to reduce OPC time for non critical pattern applied moderate fragmentation.

Paper Details

Date Published: 21 March 2007
PDF: 8 pages
Proc. SPIE 6521, Design for Manufacturability through Design-Process Integration, 65210U (21 March 2007); doi: 10.1117/12.711950
Show Author Affiliations
Jae-Hyun Kang, Dongbu Electronics (South Korea)
Sang uk Lee, Dongbu Electronics (South Korea)
Jeahee Kim, Dongbu Electronics (South Korea)
Keeho Kim, Dongbu Electronics (South Korea)


Published in SPIE Proceedings Vol. 6521:
Design for Manufacturability through Design-Process Integration
Alfred K.K. Wong; Vivek K. Singh, Editor(s)

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