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Proceedings Paper

Process optimization for developer soluble immersion topcoat material
Author(s): Hiroki Nakagawa; Kentarou Goto; Motoyuki Shima; Junichi Takahashi; Tsutomu Shimokawa; Katsunori Ichino; Naohiko Nagatani; Hideharu Kyoda; Kosuke Yoshihara
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Paper Abstract

The 193 nm immersion lithography has been increasingly applied to the semiconductor device mass production. Topcoat material would be used in many such cases. Topcoat film can maximize the scan speed during immersion exposure step and also prevent small molecules from leaching out of resist film. However, the use of the topcoat material in the mass production affects productivity including throughput and chemical cost. To manage this problem, we attempted to improve topcoat coating process to reduce the topcoat material consumption. Using JSR NFC TCX041, the developersoluble type topcoat material, as a model material, we examined a new coating process which introduces a pre-wet treatment using a solvent which was chosen to be appropriate for this purpose. With this new coating process, we achieved 65 percent (or more) reduction of the topcoat material consumption compared with the current standard coating process (dynamic coating). From the result of film surface observations and leaching tests, it was learned that the topcoat film properties by the new coating process are equivalent to those by the standard coating process. The process performance after development also indicated good results.

Paper Details

Date Published: 30 March 2007
PDF: 10 pages
Proc. SPIE 6519, Advances in Resist Materials and Processing Technology XXIV, 651923 (30 March 2007); doi: 10.1117/12.711858
Show Author Affiliations
Hiroki Nakagawa, JSR Corp. (Japan)
Kentarou Goto, JSR Corp. (Japan)
Motoyuki Shima, JSR Corp. (Japan)
Junichi Takahashi, JSR Corp. (Japan)
Tsutomu Shimokawa, JSR Corp. (Japan)
Katsunori Ichino, Tokyo Electron Kyushu Ltd. (Japan)
Naohiko Nagatani, Tokyo Electron Kyushu Ltd. (Japan)
Hideharu Kyoda, Tokyo Electron Kyushu Ltd. (Japan)
Kosuke Yoshihara, Tokyo Electron Kyushu Ltd. (Japan)

Published in SPIE Proceedings Vol. 6519:
Advances in Resist Materials and Processing Technology XXIV
Qinghuang Lin, Editor(s)

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