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Proceedings Paper

Chemical composition distribution analysis of photoresist copolymers and influence on ArF lithographic performance
Author(s): Hikaru Momose; Atsushi Yasuda; Akifumi Ueda; Takayuki Iseki; Koichi Ute; Takashi Nishimura; Ryo Nakagawa; Tatsuki Kitayama
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Paper Abstract

For getting information about the distribution of chemical composition, several model polymers were prepared under different polymerization conditions and were measured by critical adsorption point-liquid chromatography (CAP-LC). In the copolymer system of 8- and 9- (4-oxatricyclo[,6]decane-3-one) acrylate (OTDA) and 2-ethyl-2-adamantyl methacrylate (EAdMA), the peak shapes of the CAP-LC chromatogram varied according to the polymerization condition although they indicated same molecular weight and averaged chemical composition. The difference of the CAP-LC elution curves was related to the chemical composition distribution of copolymers for CAP-LC measurement combined with proton nuclear magnetic resonance (1H-NMR). The terpolymers consisted of α-hydroxy-γ-butyrolactone methacrylate (GBLMA), 2-methyl-2-adamantyl methacrylate (MAdMA) and 1-hydroxy-3-adamantyl methacrylate (HAdMA) were prepared under various polymerization conditions. In the terpolymer system that had same molecular weight and average chemical composition, the solubility parameter (&dgr;) and the dissolution rate were measured. The &dgr; value and the dissolution rate curve were different among these terpolymers. It was suggested that the &dgr; value and the chemical composition distribution of these terpolymers have a significant influence on the lithographic performance.

Paper Details

Date Published: 23 March 2007
PDF: 10 pages
Proc. SPIE 6519, Advances in Resist Materials and Processing Technology XXIV, 65192F (23 March 2007); doi: 10.1117/12.711760
Show Author Affiliations
Hikaru Momose, Mitsubishi Rayon Co., Ltd. (Japan)
Atsushi Yasuda, Mitsubishi Rayon Co., Ltd. (Japan)
Akifumi Ueda, Mitsubishi Rayon Co., Ltd. (Japan)
Takayuki Iseki, Mitsubishi Rayon Co., Ltd. (Japan)
Koichi Ute, Tokushima Univ. (Japan)
Takashi Nishimura, Osaka Univ. (Japan)
Ryo Nakagawa, Osaka Univ. (Japan)
Tatsuki Kitayama, Osaka Univ. (Japan)

Published in SPIE Proceedings Vol. 6519:
Advances in Resist Materials and Processing Technology XXIV
Qinghuang Lin, Editor(s)

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