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Proceedings Paper

Transistor-based electrical test structures for lithography and process characterization
Author(s): Wojtek J. Poppe; Juliet Holwill; Liang-Teck Pang; Paul Friedberg; Qingguo Liu; Louis Alarcon; Andrew Neureuther
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Paper Abstract

A multi-student testchip aimed at characterizing lithography related variations with over 15,000 individually probable test structures and transistors has been designed and a complementary 65nm process flow and data aggregation strategy have also been implemented. Test structures have been strategically designed to have high sensitivities to non-idealities such as defocus, LWR, misalignment and other systematic sources of variation. To enable automated measurement of massive amounts of test structures, Enhanced Transistor Electrical CD (Critical Dimension) metrology has been used as it offers high pattern density and almost no geometrical restrictions. Electrical testing at cryogenic temperatures will be employed to study the impact of Line Width Roughness (LWR) versus Random Dopant Fluctuations (RDF), which will not play a significant role at cryogenic temperatures, 4K. To facilitate data analysis and comparison of results between students, a relational database has been designed and implemented. The database will be web accessible for each student to use and update. It will serve as a collaborative platform for reinforcing conclusions, filtering out confounding data, and involving outside parties that are interested in process variations at the 65nm node. Experimental data was not available at the time this paper was written, so this paper will concentrate on the design and simulation results of test structures.

Paper Details

Date Published: 28 March 2007
PDF: 11 pages
Proc. SPIE 6520, Optical Microlithography XX, 65203N (28 March 2007); doi: 10.1117/12.711613
Show Author Affiliations
Wojtek J. Poppe, Univ. of California/Berkeley (United States)
Juliet Holwill, Univ. of California/Berkeley (United States)
Liang-Teck Pang, Univ. of California/Berkeley (United States)
Paul Friedberg, Univ. of California/Berkeley (United States)
Qingguo Liu, Univ. of California/Berkeley (United States)
Louis Alarcon, Univ. of California/Berkeley (United States)
Andrew Neureuther, Univ. of California/Berkeley (United States)


Published in SPIE Proceedings Vol. 6520:
Optical Microlithography XX
Donis G. Flagello, Editor(s)

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