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Proceedings Paper

A short-pulsed laser cleaning system for EUVL tool
Author(s): Masami Yonekawa; Hisashi Namba; Tatsuya Hayashi; Yutaka Watanabe
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Paper Abstract

A traditional method of reticle protection, using a pellicle, is thought to be difficult to apply to EUVL tool. There is a possibility that some particles adhere to the surface of a reticle. In order to resolve this reticle issue, we are investigating in-situ short-pulsed laser cleaning system. In order to confirm whether it can be applied to EUVL tool or not, we have to verify experimentally that it is possible to remove particles in vacuum without any damage to a Mo/Si multilayer. In this work, as a short-pulsed laser, a Q-switched YAG Laser (wavelength: 266~1064 nm, pulse duration time: ~7 ns) has been used. As experimental results, at the pressure on the order of 10-3 Pa, around 100% removal rate to PSL (organic) particles can be achieved without particular damage using a DUV laser. And also, it is found that a laser cleaning method in vacuum is easier to remove particles on a surface than that in atmosphere and for SiO2 and Ni (inorganic) particles, this method is particularly effective. This reason can be explained that the drag force exerted to a particle by the surrounding gas molecules is neglected at the pressure on the order of 10-3 Pa because a gas is in free molecule regime.

Paper Details

Date Published: 21 March 2007
PDF: 9 pages
Proc. SPIE 6517, Emerging Lithographic Technologies XI, 65172U (21 March 2007); doi: 10.1117/12.711357
Show Author Affiliations
Masami Yonekawa, Canon Inc. (Japan)
Hisashi Namba, Canon Inc. (Japan)
Tatsuya Hayashi, Canon Inc. (Japan)
Yutaka Watanabe, Canon Inc. (Japan)

Published in SPIE Proceedings Vol. 6517:
Emerging Lithographic Technologies XI
Michael J. Lercel, Editor(s)

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