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Proceedings Paper

CD budget analysis on hole pattern in EUVL
Author(s): Nobuyuki Iriki; Hajime Aoyama; Toshihiko Tanaka
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Paper Abstract

In this paper we focus exclusively on hole process. The motivation here is to investigate on the performance of EUVL for hole patterning in relation to contributions from mask, exposure tool, and resist process. In this paper we investigated the patterning characteristics of arrayed, staggered, and isolated holes including features showing trench patterns.

Paper Details

Date Published: 16 March 2007
PDF: 11 pages
Proc. SPIE 6517, Emerging Lithographic Technologies XI, 65172K (16 March 2007); doi: 10.1117/12.711288
Show Author Affiliations
Nobuyuki Iriki, Semiconductor Leading Edge Technologies, Inc. (Japan)
Hajime Aoyama, Semiconductor Leading Edge Technologies, Inc. (Japan)
Toshihiko Tanaka, Semiconductor Leading Edge Technologies, Inc. (Japan)


Published in SPIE Proceedings Vol. 6517:
Emerging Lithographic Technologies XI
Michael J. Lercel, Editor(s)

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