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Proceedings Paper

Across-wafer CD uniformity control through lithography and etch process: experimental verification
Author(s): Qiaolin Zhang; Cherry Tang; Jason Cain; Angela Hui; Tony Hsieh; Nick Maccrae; Bhanwar Singh; Kameshwar Poolla; Costas J. Spanos
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Paper Abstract

Process variation on lot-to-lot and wafer-to-wafer level has been well addressed using R2R control in advanced process control, however, to tackle the ever increasing die-to-die (i.e. across-wafer) level process variation at the 65nm technology node and beyond, the process control must be extended into finer domain: across-wafer level. A novel model based process control approach [2] was proposed to reduce the critical dimension (CD) variation on across-wafer level. The central idea of the proposed approach is to compensate for upstream and downstream systematic CD variation by adjusting the across-wafer Post-Exposure Bake (PEB) temperature profile of a multi-zone bake plate. A temperature-to-offset model relating the PEB temperature profile of multi-zone bake plate to its heater zone offsets was constructed experimentally using wireless temperature sensors from OnWafer Technologies. The baseline post-etch CD signature and plasma etch bias signature were extracted to characterize the lithography and etch processes. And a post-etch CD variation reduction of 40% was realized in the verification experiment, which validated the efficacy of the proposed approach.

Paper Details

Date Published: 5 April 2007
PDF: 10 pages
Proc. SPIE 6518, Metrology, Inspection, and Process Control for Microlithography XXI, 65182C (5 April 2007); doi: 10.1117/12.711232
Show Author Affiliations
Qiaolin Zhang, Univ. of California, Berkeley (United States)
Cherry Tang, Spansion Inc. (United States)
Jason Cain, Advanced Micro Devices, Inc. (United States)
Angela Hui, Spansion, Inc. (United States)
Tony Hsieh, Spansion, Inc. (United States)
Nick Maccrae, Spansion, Inc. (United States)
Bhanwar Singh, Advanced Micro Devices, Inc. (United States)
Kameshwar Poolla, Univ. of California, Berkeley (United States)
Costas J. Spanos, Univ. of California, Berkeley (United States)


Published in SPIE Proceedings Vol. 6518:
Metrology, Inspection, and Process Control for Microlithography XXI
Chas N. Archie, Editor(s)

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