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Proceedings Paper

Demolding strategy to improve the hot embossing throughput
Author(s): Tanguy Leveder; Stefan Landis; Laurent Davoust; Sebastien Soulan; Nicolas Chaix
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Paper Abstract

Hot embossing throughput is a key issue, which has been addressed in this paper. We show how it is possible to remove the mold from the imprinted resist at the imprint temperature. We study reflow behavior of imprinted patterns, and make a cooling and quenching simulation. This work can lead to design of cooling tools adapted to a given application, and suits as well for the full wafer imprint, as well for the roll imprint.

Paper Details

Date Published: 15 March 2007
PDF: 8 pages
Proc. SPIE 6517, Emerging Lithographic Technologies XI, 65170N (15 March 2007); doi: 10.1117/12.711151
Show Author Affiliations
Tanguy Leveder, CEA - Leti \ Minatec (France)
Stefan Landis, CEA - Leti \ Minatec (France)
Laurent Davoust, LEGI/ENSHMG (France)
Sebastien Soulan, CNRS-LTM (France)
Nicolas Chaix, CNRS-LTM (France)

Published in SPIE Proceedings Vol. 6517:
Emerging Lithographic Technologies XI
Michael J. Lercel, Editor(s)

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