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Proceedings Paper

Post exposure bake unit equipped with wafer-shape compensation technology
Author(s): Shigehiro Goto; Akihiko Morita; Kenichi Oyama; Shimpei Hori; Keiji Matsuchika; Hideyuki Taniguchi
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Paper Abstract

In 193nm lithography, it is well known that Critical Dimension Uniformity (CDU) within wafer is especially influenced by temperature variation during Post Exposure Bake (PEB) process. This temperature variation has been considered to be caused by the hot plate unit, and improvement of temperature uniformity within hot plate itself has been focused to achieve higher CDU. However, we have found that the impact of the wafer shape on temperature uniformity within wafer can not be ignored when the conventional PEB processing system is applied to an advanced resist technology. There are two factors concerned with the wafer shape. First, gravity force of the wafer itself generates wafer shape bending because wafer is simply supported by a few proximity gaps on the conventional hot plate. Next, through the semiconductor manufacturing process, wafer is gradually warped due to the difference of the surface stress between silicon and deposited film layers (Ex. Si-Oxide, Si-Nitride). Therefore, the variation of the clearance between wafer backside and hot plate surface leads to non-uniform thermal conductivity within wafer during PEB processing, and eventually impacts on the CDU within wafer. To overcome this problem concerned with wafer shape during PEB processing, we have developed the new hot plate equipped with the wafer shape compensation technology. As a result of evaluation, we have confirmed that this new PEB system has an advantage not only for warped wafer but also for flat (bare) wafer.

Paper Details

Date Published: 26 March 2007
PDF: 8 pages
Proc. SPIE 6519, Advances in Resist Materials and Processing Technology XXIV, 651937 (26 March 2007); doi: 10.1117/12.711095
Show Author Affiliations
Shigehiro Goto, Sokudo Co., Ltd. (Japan)
Akihiko Morita, Sokudo Co., Ltd. (Japan)
Kenichi Oyama, Sokudo Co., Ltd. (Japan)
Shimpei Hori, Sokudo Co., Ltd. (Japan)
Keiji Matsuchika, Sokudo Co., Ltd. (Japan)
Hideyuki Taniguchi, Sokudo Co., Ltd. (Japan)


Published in SPIE Proceedings Vol. 6519:
Advances in Resist Materials and Processing Technology XXIV
Qinghuang Lin, Editor(s)

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