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Proceedings Paper

Fabrication of a flexible optical printed circuit board (FO-PCB)
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Paper Abstract

We report on the fabrication of a flexible optical interconnection module that has been incorporated as a part of an optical printed circuit board (O-PCB). Optical waveguide arrays are fabricated on flexible polyethylen terephthalate (PET) substrate by UV embossing technology. Electrical layers carrying vertical cavity surface emitted laserdiode (VCSEL) and photodiode (PD) array are attached to the optical layer. We measured optical losses of the flexible waveguide arrays bent over various curvatures and characterized transmission performances of the flexible optical PCB (FO-PCB) module. FO-PCB performed high speed optical interconnection between chips over four waveguide channels up to 7.5Gbps on each.

Paper Details

Date Published: 13 March 2007
PDF: 6 pages
Proc. SPIE 6476, Optoelectronic Integrated Circuits IX, 64760M (13 March 2007); doi: 10.1117/12.708704
Show Author Affiliations
Hyun-Shik Lee, Inha Univ. (South Korea)
Shin-Mo An, Inha Univ. (South Korea)
Seung Gol Lee, Inha Univ. (South Korea)
B. H. O, Inha Univ. (South Korea)
Se Geon Park, Inha Univ. (South Korea)
El-Hang Lee, Inha Univ. (South Korea)


Published in SPIE Proceedings Vol. 6476:
Optoelectronic Integrated Circuits IX
Louay A. Eldada; El-Hang Lee, Editor(s)

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