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Proceedings Paper

Enhancing silicon cutting performance by shaping the focused beam
Author(s): Leonard Migliore
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Paper Abstract

Singulation of devices from processed silicon wafers has historically been accomplished by cutting with mechanical saws. Current trends toward the use of thinner wafers coated with mechanically weak dielectrics reduce the speed and quality of mechanical cutting processes. The speed of laser cutting, which has previously been too low for practical implementation, may be increased significantly by altering the beam characteristics of a frequency-tripled Nd laser to produce an elliptical focused spot. Using a commercially available laser, the cutting speed exceeded that of mechanical cutting. The fracture strength of the edges as measured by bend testing is higher for elliptical beams than for round ones.

Paper Details

Date Published: 13 March 2007
PDF: 9 pages
Proc. SPIE 6458, Photon Processing in Microelectronics and Photonics VI, 64580W (13 March 2007); doi: 10.1117/12.708642
Show Author Affiliations
Leonard Migliore, Coherent, Inc. (United States)


Published in SPIE Proceedings Vol. 6458:
Photon Processing in Microelectronics and Photonics VI
David B. Geohegan; Craig B. Arnold; Tatsuo Okada; Frank Träger; Jan J. Dubowski; Michel Meunier; Andrew S. Holmes, Editor(s)

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