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Proceedings Paper

Rapid bio-patterning method based on the fabrication of PEG microstructures and layer-by-layer polymeric thin film
Author(s): Hyun-Woo Shim; Ji-Hye Lee; Chang-Hyoung Choi; Hwan-Moon Song; Bo-Yeol Kim; Dong-Pyo Kim; Chang-Soo Lee
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Paper Abstract

The patterning of biomolecules in well-defined microstructures is critical issue for the development of biosensors and biochips. However, the fabrication of microstructures with well-ordered and spatially discrete forms to provide the patterned surface for the immobilization of biomolecules is difficult because of the lack of distinct physical and chemical barriers separating patterns. This study present rapid biomolecule patterning using micromolding in capillaries (MIMIC), soft-lithographic fabrication of PEG microstructures for prevention of nonspecific binding as a biological barrier, and self assembled polymeric thin film for efficient immobilization of proteins or cells. For the proof of concept, protein (FITC-BSA), bacteria (E.coli BL21-pET23b-GFP) were used for biomolecules patterning on polyelectrolyte coated surface within PEG microstructures. The novel approach of MIMIC combined with LbL coating provides a general platform for patterning a broad range of materials because it can be easily applied to various substrates such as glass, silicon, silicon dioxide, and polymers.

Paper Details

Date Published: 14 December 2006
PDF: 4 pages
Proc. SPIE 6416, Biomedical Applications of Micro- and Nanoengineering III, 641614 (14 December 2006); doi: 10.1117/12.708559
Show Author Affiliations
Hyun-Woo Shim, Chungnam National Univ. (South Korea)
Ji-Hye Lee, Chungnam National Univ. (South Korea)
Chang-Hyoung Choi, Chungnam National Univ. (South Korea)
Hwan-Moon Song, Chungnam National Univ. (South Korea)
Bo-Yeol Kim, Chungnam National Univ. (South Korea)
Dong-Pyo Kim, Chungnam National Univ. (South Korea)
Chang-Soo Lee, Chungnam National Univ. (South Korea)


Published in SPIE Proceedings Vol. 6416:
Biomedical Applications of Micro- and Nanoengineering III
Dan V. Nicolau, Editor(s)

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