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Proceedings Paper

Low-viscosity and fast-curing polymer system for UV-based nanoimprint lithography and its processing
Author(s): Marko Vogler; Markus Bender; Ulrich Plachetka; Andreas Fuchs; Sabine Wiedenberg; Freimut Reuther; Gabi Grützner; Heinrich Kurz
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Paper Abstract

One of the key elements for the successful integration of nanoimprint lithography into industrial production processes is the availability of high-performance resist materials. In this contribution we present a novel low-viscosity and fast curing UV-NIL polymer, which is applied by spin-coating and designed for wafer-scale imprinting. Systematic investigations of photocurable components and photoinitiators led to the formulation of the polymer system mr-UVCur06. Film thicknesses in the range of 50 - 500 nm with excellent quality and uniformity could be obtained by spin-coating. Its suitability for UV-NIL processes was evaluated by means of imprinting tests and plasma etching investigations. This included investigations on imprinting with hard moulds, UV curing doses, resolution, etch rates using various plasma gases and pattern transfer. The beneficial flow behaviour of mr-UVCur06 led to short UV-NIL cycle times. Patterns of several orders of magnitude with feature sizes in the range of 30 nm to several tens of micrometers could be imprinted simultaneously. An example of a pattern transfer into Si was shown, where mr-UVCur06 was used as an polymer etch mask.

Paper Details

Date Published: 21 March 2007
PDF: 11 pages
Proc. SPIE 6517, Emerging Lithographic Technologies XI, 651727 (21 March 2007); doi: 10.1117/12.708507
Show Author Affiliations
Marko Vogler, micro resist technology GmbH (Germany)
Markus Bender, AMO GmbH (Germany)
Ulrich Plachetka, AMO GmbH (Germany)
Andreas Fuchs, AMO GmbH (Germany)
Sabine Wiedenberg, micro resist technology GmbH (Germany)
Freimut Reuther, micro resist technology GmbH (Germany)
Gabi Grützner, micro resist technology GmbH (Germany)
Heinrich Kurz, AMO GmbH (Germany)


Published in SPIE Proceedings Vol. 6517:
Emerging Lithographic Technologies XI
Michael J. Lercel, Editor(s)

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