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Proceedings Paper

Compact parallel optical interface built with optical fiber tips
Author(s): Christophe Kopp; Karen Gilbert; Stéphane Bernabe; Blandine Albert
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Paper Abstract

MultiChip Module approach and the use of micro-optics offer determinant solutions to reach the mechanical compactness required by most applications for high rate data communications transmitters and receivers. Such a miniaturization often leads to develop very challenging assembling processes when fiber coupling is needed. In this paper we present an original fabrication process to build very small parallel optical interface with optical fiber tips. This fabrication process is based on common fiber ribbon mounting into wet etched V shaped holder into silicon and a dicing-polishing step to create small pieces with optical quality considering flatness and roughness. The dicing-polishing principle is well-known in integrated waveguides technology. An example of realization is presented to connect a parallel optical subassembly transmitter with a MPO/MTP connector. The results show that the dicing-polishing step allows to obtain a diced-polished face with a roughness about 5 to 10nm onto the fiber. Such an optical quality is as good as a cleaved fiber when measuring light coupling performances. Thus, such micro-optical components offer a new building block for designers to extract the light from their photonic devices. Moreover, the fabrication process appears to be low cost and compatible with mass production.

Paper Details

Date Published: 8 September 2006
PDF: 7 pages
Proc. SPIE 6343, Photonics North 2006, 634341 (8 September 2006); doi: 10.1117/12.708261
Show Author Affiliations
Christophe Kopp, CEA-LETI/DOPT/SIONA (France)
Karen Gilbert, CEA-LETI/DOPT/SIONA (France)
Stéphane Bernabe, Intexys Photonics (France)
Blandine Albert, Intexys Photonics (France)

Published in SPIE Proceedings Vol. 6343:
Photonics North 2006
Pierre Mathieu, Editor(s)

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