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Proceedings Paper

Fabrication of polymer AWG demultiplexer using embossing technique
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Paper Abstract

We fabricated an arrayed waveguide grating (AWG) demultiplexer for optical fiber communication systems and photonic integrated circuits. We also used an embossing technique to fabricated the AWG instead of traditional semiconductor technologies, such as photolithography and etch process. UV curable polymers (ZPU 12-47 and ZPU 12- 45) were used as the core and upper cladding layers. The polydimethylsiloxane (PDMS) mold used for the embossing process is manufactured by a photoresist structure formed on a silicon wafer. We tried the embossing onto a fused silica glass using the PDMS mold. After UV curing, the PDMS mold was peeled away carefully, and a pattern of the AWG demultiplexer was left on the surface of that substrate. The upper cladding layer was coated over the patterned structure. The fabrication of the AWG demultiplexer was completed by a cleaving process. The residual layer produced after an embossing process was adjusted by the volume of polymer droplet. The embossing technique will have the potential for broad applications in fabrication of photonic devices.

Paper Details

Date Published: 14 February 2007
PDF: 8 pages
Proc. SPIE 6476, Optoelectronic Integrated Circuits IX, 64760Y (14 February 2007); doi: 10.1117/12.707301
Show Author Affiliations
Chul-Hyun Choi, Inha Univ. (South Korea)
Min Woo Lee, Inha Univ. (South Korea)
Jun-Ho Sung, Inha Univ. (South Korea)
Bo-Soon Kim, Inha Univ. (South Korea)
Jeong Su Yang, Inha Univ. (South Korea)
El-Hang Lee, Inha Univ. (South Korea)
Beom-Hoan O, Inha Univ. (South Korea)


Published in SPIE Proceedings Vol. 6476:
Optoelectronic Integrated Circuits IX
Louay A. Eldada; El-Hang Lee, Editor(s)

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