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Proceedings Paper

3.2Gbps multi-channel optical backplane bus demonstrator using photopolymer volume gratings
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Paper Abstract

A 3-slot optical backplane bus demonstrator based on glass substrate with photopolymer volume gratings array (PVGA) on top surface is built to allow 16 channels of data to be broadcast from central slot to two daughter slots or uploaded from any daughter slot to central slot. VCSELs and photodetectors packaged in the form of TO-46 can are assembled on top of each PVG and interleaved to reduce the crosstalk to below noise level. By carefully aligning the fabrication system, the incident angle deviation from Bragg condition is reduced to below 0.1° to maximize optical power delivery. The orientation and period of hologram fringes are uniform in the active area by collimating recording beams. Above 4.8Gbps aggregated data transmission is successfully demonstrated using the multi-channel system. Three computer mother boards using FPGA are made to verify the data transmission among the slots. Interface boards between the FPGA boards and optical transceivers are designed and fabricated to separate the implementation of digital layer and optical layer. Single channel transmissions with 3.2Gbps and even 10Gbps data rate are also tested with above 100uW input power, showing the potential to improve the total two-way bandwidth to above 102.4Gbps. Alignment tolerance of the optical interconnect system is investigated theoretically and experimentally. By analyzing the diffractive characteristics, the bandwidth limit of the optical layer is determined to be in the order of Terahertz. Design and fabrication issues are discussed for future optical backplane bus to make terahertz bandwidth into reality. Based on the experiments for Bit-interleaved Optical Backplane bus and Multi-channel optical backplane bus demonstrators, theoretical analysis of the bandwidth limit of the optical backplane bus using photopolymer volume gratings has been carried out.

Paper Details

Date Published: 9 February 2007
PDF: 10 pages
Proc. SPIE 6478, Photonics Packaging, Integration, and Interconnects VII, 64780C (9 February 2007); doi: 10.1117/12.705429
Show Author Affiliations
Hai Bi, Univ. of Texas at Austin (United States)
Jinho Choi, Univ. of Texas at Austin (United States)
Wei Jiang, Univ. of Texas at Austin (United States)
Xuliang Han, Univ. of Texas at Austin (United States)
Brewer Science, Inc. (United States)
Jonathan Ellis, Advanced Communications Concepts, Inc. (United States)
Ray T. Chen, Univ. of Texas at Austin (United States)

Published in SPIE Proceedings Vol. 6478:
Photonics Packaging, Integration, and Interconnects VII
Allen M. Earman; Ray T. Chen, Editor(s)

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