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Proceedings Paper

Structured beam shaping for precision laser dicing of multilayered substrates
Author(s): Todd Lizotte; Orest Ohar
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Paper Abstract

Laser dicing of wafer based devices; such as light emitting diodes (LEDs) is multifaceted since these devices are formed from various materials in a layered structure. Many of these layers include active device materials, passivation coatings, conductors and dielectric films all deposited on top of a bulk wafer substrate and all potentially having different ablation thresholds. These composite multi-layered structures require high finesse laser processes to ensure yields, high quality and low cost. Such processes have become very complex over the years as new devices become miniaturized, requiring smaller micro-machined features, greater precision and reduction of thermal stress to minimize substrate micro-cracking and maintain device integrity over its projected lifetime. Newer laser processes often involve the sequential use of single or multiple diode pumped solid state (DPSS) lasers, such as UV DPSS (355nn, 266nm), VIS DPSS (~532 nm) and IR DPSS (1064nm, 1070nm) as well as DPFL (Diode Pumped Fiber Lasers) lasers to penetrate various and differing material layers and substrates including SiC, Silicon and Sapphire. Development of beam shaping optics with the purpose of permitting two or more differing energy densities within a single focused or imaged beam spot would provide opportunities for pre-processing or pre-scribing of thinner cover layers, while following through with a higher energy density portion to cut through base substrates. This technique is also possible using multiple wavelengths simultaneously for micro-machining or dicing. Using multiple wavelengths offers advantages where high photon energies from such wavelengths as 266 nm can cause adverse effects to doped materials such as silicon or to active device layers such as GaN or other III-V materials deposited on the substrate surface. This paper will describe the development of variable intensity beam shaping optical elements targeting micromachining, dicing and patterning of delicate thin film coatings. Various diffractive and holographic optic designs will be described, with examples, including select functional testing of the optics and examples of the optics use in laser micromachining various materials.

Paper Details

Date Published: 13 March 2007
PDF: 9 pages
Proc. SPIE 6458, Photon Processing in Microelectronics and Photonics VI, 64580X (13 March 2007); doi: 10.1117/12.702299
Show Author Affiliations
Todd Lizotte, Hitachi Via Mechanics USA, Inc. (United States)
Orest Ohar, Hitachi Via Mechanics USA, Inc. (United States)

Published in SPIE Proceedings Vol. 6458:
Photon Processing in Microelectronics and Photonics VI
David B. Geohegan; Craig B. Arnold; Tatsuo Okada; Frank Träger; Jan J. Dubowski; Michel Meunier; Andrew S. Holmes, Editor(s)

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