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Proceedings Paper

Wafer capping of MEMS with fab-friendly metals
Author(s): Jack Martin
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Paper Abstract

Inertial MEMS (Micro Electro Mechanical System) sensors are normally sealed in hermetic enclosures. Some are assembled in hermetic packages but wafer level packaging has become much more important in recent years. Anodic bonding can be used to achieve wafer level seals between silicon and glass but most suppliers of inertial sensors screen print glass frit onto silicon cap wafers. After removing the organic vehicle, these patterned cap wafers are sealed to device wafer prior to wafer singulation and plastic packaging. Anodic and glass frit bonding are both cost-effective. However, they impose size, quality and performance limitations. Wafer level sealing with a metal removes some of these limitations but introduces other concerns. This paper will review the current wafer level hermetic processes followed by a description of a thermocompression metal seal technology that is compatible with IC fabrication.

Paper Details

Date Published: 19 January 2007
PDF: 6 pages
Proc. SPIE 6463, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI, 64630M (19 January 2007); doi: 10.1117/12.701573
Show Author Affiliations
Jack Martin, Analog Devices, Inc. (United States)

Published in SPIE Proceedings Vol. 6463:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI
Allyson L. Hartzell; Rajeshuni Ramesham, Editor(s)

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