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Proceedings Paper

Robust hard-solder packaging of conduction cooled laser diode bars
Author(s): David Schleuning; Mike Griffin; Philip James; John McNulty; Dan Mendoza; John Morales; David Nabors; Mike Peters; Hailong Zhou; Murray Reed
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Paper Abstract

We present the reliability of high-power laser diodes utilizing hard solder (AuSn) on a conduction-cooled package (HCCP). We present results of 50 W hard-pulse operation at 8xx nm and demonstrate a reliability of MTTF > 27 khrs (90% CL), which is an order of magnitude improvement over traditional packaging. We also present results at 9xx nm with a reliability of MTTF >17 khrs (90% CL) at 75 W. We discuss finite element analysis (FEA) modeling and time dependent temperature measurements combined with experimental life-test data to quantify true hard-pulse operation. We also discuss FEA and measured stress profiles across laser bars comparing soft and hard solder packaging.

Paper Details

Date Published: 7 February 2007
PDF: 11 pages
Proc. SPIE 6456, High-Power Diode Laser Technology and Applications V, 645604 (7 February 2007); doi: 10.1117/12.701292
Show Author Affiliations
David Schleuning, Coherent, Inc. (United States)
Mike Griffin, Coherent, Inc. (United States)
Philip James, Coherent, Inc. (United States)
John McNulty, Coherent, Inc. (United States)
Dan Mendoza, Coherent, Inc. (United States)
John Morales, Coherent, Inc. (United States)
David Nabors, Coherent, Inc. (United States)
Mike Peters, Coherent, Inc. (United States)
Hailong Zhou, Coherent, Inc. (United States)
Murray Reed, Coherent, Inc. (United States)


Published in SPIE Proceedings Vol. 6456:
High-Power Diode Laser Technology and Applications V
Mark S. Zediker, Editor(s)

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