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Proceedings Paper

High-precision small geometry laser trimming for emerging microelectronics devices
Author(s): Bo Gu
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Paper Abstract

Laser trimming of microelectronics devices has enabled the fabrication of high precision and high performance components and networks. Market demands for decreasing package size and higher performance components have pushed the current laser trimming technology to its limits. To meet the challenges, laser trimming system manufacturers have been working on the new generation based on significant advances in laser technology, software tools, and related system technologies. These new systems can achieve higher accuracy needed for processing devices with ever shrinking dimensions and tighter tolerances while offering maintenance-free operation and flexibility in today's demanding production environments. We will present in this paper the latest advancement of laser based trimming systems. Future directions will also be discussed.

Paper Details

Date Published: 20 March 2007
PDF: 7 pages
Proc. SPIE 6459, Laser-based Micro- and Nanopackaging and Assembly, 64590K (20 March 2007); doi: 10.1117/12.701145
Show Author Affiliations
Bo Gu, GSI Group (United States)


Published in SPIE Proceedings Vol. 6459:
Laser-based Micro- and Nanopackaging and Assembly
Wilhelm Pfleging; Yongfeng Lu; Kunihiko Washio; Friedrich G. Bachmann; Willem Hoving, Editor(s)

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