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Proceedings Paper

Effects of V additions on the mechanical behavior of Au thin films for MEMS contact switches
Author(s): T. Bannuru; S. Narksitipan; W. L. Brown; R. P. Vinci
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Paper Abstract

Au, Au-V solid solution, and Au-V2O5 dispersion films were fabricated for comparison of electrical and mechanical characteristics. Resistivity and nanoindentation hardness increased with increasing V content in all films, but the ratio of resistivity increase to hardness increase was much lower for the Au-V2O5 films. Measurements of contact force and electrical contact resistance between pairs of Au or Au-V films show that increased hardness and resistivity in the alloy films results in higher contact resistance and less adhesion than in pure Au. These results imply that the Au-V2O5 films may exhibit attractive behavior when used in a contact configuration, but this has not yet been tested.

Paper Details

Date Published: 19 January 2007
PDF: 6 pages
Proc. SPIE 6463, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI, 646306 (19 January 2007); doi: 10.1117/12.700834
Show Author Affiliations
T. Bannuru, Lehigh Univ. (United States)
S. Narksitipan, Chiang Mai Univ. (Thailand)
W. L. Brown, Lehigh Univ. (United States)
R. P. Vinci, Lehigh Univ. (United States)

Published in SPIE Proceedings Vol. 6463:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI
Allyson L. Hartzell; Rajeshuni Ramesham, Editor(s)

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