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Proceedings Paper

Enhancement of Raman scattering using silica microparticles
Author(s): K. J. Yi; Y. F. Lu; H. Wang; Z. Y. Yang
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Paper Abstract

Currently, enhancement of Raman scattering for nanoscale characterization is mostly based on tip- or surface-enhanced methods. However, both approaches have some dilemmas which impede their wide applications. In this study, we investigated a novel approach to enhance Raman scattering using closely-packed micro and submicro silica spherical particles. The enhancement phenomena haven been demonstrated by the silicon phonon mode of crystalline silicon (c-Si) substrates as well as the vibration modes of single-walled carbon nanotubes (SWCNTs) covered with microparticles. The studies show that the enhancement effects strongly depend on the particle size. Specifically, when the particle size is close to the beam waist of the incident laser, the strongest enhancement occurs. Numerical simulations are performed to calculate electric field distribution inside and outside the dielectric particles using the OptiwaveTM software which is based on the finite difference time domain (FDTD) algorithm under the perfectly matched layer (PML) boundary conditions. The simulated results reveal the existence of photonic nanojects in the vicinity outside the particles along with the light traveling direction. The nanojets outside of the particles with a length of 100 nm and a waist of 120 nm are believed to be the base for Raman scattering enhancement. This technique has potential applications in many areas such as surface science, biology, and microelectronics.

Paper Details

Date Published: 20 March 2007
PDF: 10 pages
Proc. SPIE 6459, Laser-based Micro- and Nanopackaging and Assembly, 64590T (20 March 2007); doi: 10.1117/12.700693
Show Author Affiliations
K. J. Yi, Univ. of Nebraska/Lincoln (United States)
Y. F. Lu, Univ. of Nebraska/Lincoln (United States)
H. Wang, Univ. of Nebraska/Lincoln (United States)
Z. Y. Yang, Univ. of Nebraska/Lincoln (United States)


Published in SPIE Proceedings Vol. 6459:
Laser-based Micro- and Nanopackaging and Assembly
Wilhelm Pfleging; Yongfeng Lu; Kunihiko Washio; Friedrich G. Bachmann; Willem Hoving, Editor(s)

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