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Fabrication of thin-GaN LED by wafer bonding and electro-plating thick metal film
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Proc. SPIE 6486, Light-Emitting Diodes: Research, Manufacturing, and Applications XI, 648618; doi: 10.1117/12.700065
Show Author Affiliations
Chia-Lun Chang, National Central Univ. (Taiwan)
Chengyi Liu, National Central Univ. (Taiwan)


Published in SPIE Proceedings Vol. 6486:
Light-Emitting Diodes: Research, Manufacturing, and Applications XI
Klaus P. Streubel; Heonsu Jeon, Editor(s)

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