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Proceedings Paper

Thermally induced stresses resulting from coefficient of thermal expansion differentials between an LED sub-mount material and various mounting substrates
Author(s): Charles DeMilo; Corey Bergad; Ronald Forni; Thomas Brukilacchio
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Paper Abstract

A study has been conducted to determine the effects of mechanical stresses induced from the coefficient of thermal expansion (CTE) differential between a light emitting diode (LED) chip, and various substrate materials to which the LEDs were mounted. The LEDs were bonded to typical packaging materials including ceramics, copper and metal matrix composites. The objective of this investigation was to determine the viability of implementing alternate substrate materials for packaging of LED power chips. In particular, thermally induced stresses resulting from the CTE differentials between the alternate substrate materials and the LED sub-mount material were analyzed and compared against the stresses resulting from the nearly ideal CTE match that is realized with traditional ceramic substrates.

Paper Details

Date Published: 13 February 2007
PDF: 10 pages
Proc. SPIE 6486, Light-Emitting Diodes: Research, Manufacturing, and Applications XI, 64860N (13 February 2007); doi: 10.1117/12.697489
Show Author Affiliations
Charles DeMilo, Innovations in Optics, Inc. (United States)
Corey Bergad, Innovations in Optics, Inc. (United States)
Ronald Forni, Innovations in Optics, Inc. (United States)
Thomas Brukilacchio, Innovations in Optics, Inc. (United States)


Published in SPIE Proceedings Vol. 6486:
Light-Emitting Diodes: Research, Manufacturing, and Applications XI
Klaus P. Streubel; Heonsu Jeon, Editor(s)

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