Share Email Print
cover

Proceedings Paper

Thermal and mechanical joints to cryo-cooled silicon monochromator crystals
Author(s): A. MacDowell; S. Fakra; G. Morrison
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We describe the performance of various materials used as the thermal interface between silicon to silicon and silicon to copper joints when operated at ~120K and loaded with ~20 watts of thermal power. We find that only the indium based silicon-to-silicon joint is reliable.

Paper Details

Date Published: 29 August 2006
PDF: 6 pages
Proc. SPIE 6317, Advances in X-Ray/EUV Optics, Components, and Applications, 63171F (29 August 2006); doi: 10.1117/12.697083
Show Author Affiliations
A. MacDowell, Lawrence Berkeley National Lab. (United States)
S. Fakra, Lawrence Berkeley National Lab. (United States)
G. Morrison, Lawrence Berkeley National Lab. (United States)


Published in SPIE Proceedings Vol. 6317:
Advances in X-Ray/EUV Optics, Components, and Applications
Ali M. Khounsary; Christian Morawe, Editor(s)

© SPIE. Terms of Use
Back to Top