Share Email Print
cover

Proceedings Paper

Adhesive wafer-to-wafer bonding using contact imprinting
Author(s): Liming Yu; Ah Ju Pang; Bangtao Chen; Francis E. H. Tay; Ciprian Iliescu
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

The present work proposes an adhesive bonding technique, at wafer level, using SU-8 negative photoresist as intermediate layer. The adhesive was selective imprint on one of the bonding surface. The main applications are in microfluidic area where a low temperature bonding is required. The method consists of three major steps. First the adhesive layer is deposited on one of the bonding surface by contact imprinting from a dummy wafer where the SU-8 photoresist was initially spun, or from a Teflon cylinder. Second, the wafers to be bonded are placed in contact and aligned. In the last step, the bonding process is performed at temperatures between 100°C and 200°C, a pressure of 1000 N in vacuum on a classical wafer bonding system. The results indicate a low stress value induced by the bonding technique. In the same time the process presents a high yield: 95-100%. The technique was successfully tested in the fabrication process of a dielectrophoretic device.

Paper Details

Date Published: 20 December 2006
PDF: 7 pages
Proc. SPIE 6415, Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems III, 64151I (20 December 2006); doi: 10.1117/12.696544
Show Author Affiliations
Liming Yu, Institute of Bioengineering and Nanotechnology (Singapore)
National Univ. of Singapore (Singapore)
Ah Ju Pang, Institute of Bioengineering and Nanotechnology (Singapore)
Bangtao Chen, Institute of Bioengineering and Nanotechnology (Singapore)
Francis E. H. Tay, Institute of Bioengineering and Nanotechnology (Singapore)
National Univ. of Singapore (Singapore)
Ciprian Iliescu, Institute of Bioengineering and Nanotechnology (Singapore)


Published in SPIE Proceedings Vol. 6415:
Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems III
Jung-Chih Chiao; Andrew S. Dzurak; Chennupati Jagadish; David Victor Thiel, Editor(s)

© SPIE. Terms of Use
Back to Top