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Proceedings Paper

Managing design for manufacture and assembly in the development of MEMS-based products
Author(s): Hung-Yao Hsu; Nachchinarkkinian Narasimhan; Alex J. Hariz
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Paper Abstract

Design for manufacturability, assembly and reliability of MEMS products is being applied to a multitude of novel MEMS products to make up for the lack of "Standard Process for MEMS" concept. The latter has proved a major handicap in commercialization of MEMS devices when compared to integrated circuits products. Furthermore, an examination of recent engineering literature seems to suggest convergence towards the development of the design for manufacturability and reliability of MEMS products. This paper will highlight the advantages and disadvantages of conventional techniques that have been pursued up to this point to achieve commercialization of MEMS products, identify some of the problems slowing down development, and explore measures that could be taken to try to address those problems. Successful commercialization critically depends on packaging and assembly, manufacturability, and reliability for micro scale products. However, a methodology that appropriately shadows next generation knowledge management will undoubtedly address most of the critical problems that are hampering development of MEMS industries. Finally this paper will also identify contemporary issues that are challenging the industry in regards to product commercialization and will recommend appropriate measures based on knowledge flow to address those shortcomings and lay out plans to expedient and successful paths to market.

Paper Details

Date Published: 20 December 2006
PDF: 12 pages
Proc. SPIE 6415, Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems III, 64150Z (20 December 2006); doi: 10.1117/12.696230
Show Author Affiliations
Hung-Yao Hsu, Univ. of South Australia (Australia)
Nachchinarkkinian Narasimhan, Univ. of South Australia (Australia)
Alex J. Hariz, Univ. of South Australia (Australia)

Published in SPIE Proceedings Vol. 6415:
Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems III
Jung-Chih Chiao; Andrew S. Dzurak; Chennupati Jagadish; David Victor Thiel, Editor(s)

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