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Proceedings Paper

MOEMS development of infrared security sensors
Author(s): Kevin C. Liddiard
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Paper Abstract

This paper discusses progress in the development of a new generation of passive infrared (PIR) security sensors for the high volume military, industrial and consumer markets. Recent work on patented sensor technology is described, including the mosaic pixel focal plane array concept (MP-FPA), which enables enhanced sensor performance to be achieved with low cost optics and cheap packaging. MOEMS technology is employed for fabrication of silicon microbolometer detector arrays, which are integrated on-chip with a CMOS readout integrated circuit, and can be fabricated by large scale production methods in a silicon-based MEMS foundry. The paper addresses the application of this technology to PIR security sensors.

Paper Details

Date Published: 8 January 2007
PDF: 10 pages
Proc. SPIE 6414, Smart Structures, Devices, and Systems III, 641417 (8 January 2007); doi: 10.1117/12.695680
Show Author Affiliations
Kevin C. Liddiard, Electro-optic Sensor Design (Australia)

Published in SPIE Proceedings Vol. 6414:
Smart Structures, Devices, and Systems III
Said F. Al-Sarawi, Editor(s)

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