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Proceedings Paper

Feature extraction from terahertz pulses for classification of RNA data via support vector machines
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Paper Abstract

This study investigates binary and multiple classes of classification via support vector machines (SVMs). A couple of groups of two dimensional features are extracted via frequency orientation components, which result in the effective classification of Terahertz (T-ray) pulses for discrimination of RNA data and various powder samples. For each classification task, a pair of extracted feature vectors from the terahertz signals corresponding to each class is viewed as two coordinates and plotted in the same coordinate system. The current classification method extracts specific features from the Fourier spectrum, without applying an extra feature extractor. This method shows that SVMs can employ conventional feature extraction methods for a T-ray classification task. Moreover, we discuss the challenges faced by this method. A pairwise classification method is applied for the multi-class classification of powder samples. Plots of learning vectors assist in understanding the classification task, which exhibit improved clustering, clear learning margins, and least support vectors. This paper highlights the ability to use a small number of features (2D features) for classification via analyzing the frequency spectrum, which greatly reduces the computation complexity in achieving the preferred classification performance.

Paper Details

Date Published: 20 December 2006
PDF: 13 pages
Proc. SPIE 6415, Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems III, 641516 (20 December 2006); doi: 10.1117/12.695629
Show Author Affiliations
Xiaoxia Yin, The Univ. of Adelaide (Australia)
Brian W.-H. Ng, The Univ. of Adelaide (Australia)
Bernd Fischer, The Univ. of Adelaide (Australia)
Bradley Ferguson, The Univ. of Adelaide (Australia)
Tenix (Australia)
Samuel P. Mickan, The Univ. of Adelaide (Australia)
Derek Abbott, The Univ. of Adelaide (Australia)

Published in SPIE Proceedings Vol. 6415:
Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems III
Jung-Chih Chiao; Andrew S. Dzurak; Chennupati Jagadish; David Victor Thiel, Editor(s)

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