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Proceedings Paper

Energy variation of micro-cracking on single crystal silicon
Author(s): F. Z. Fang; Y. C. Liu
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Paper Abstract

The results from nano indentation is employed to study the mechanical behaviour of materials at nanometric scale. Based on the extensive experiments using nano indentation, a new phenomenon is discovered in understanding micro cracking on single crystal silicon. Thus, a new method is proposed in evaluating the micro cracks occurring, i.e., an increasing rate of absorbed energy, which is significant in examining the brittle-to-ductile transition of single crystal silicon. This method provides a simple approach in understanding the micro cracks, while it is very tedious in conventional method. Experimental studies reveal that the increasing rate of absorbed energy in nano indentation presents an identical correlation to the surface cracks on single crystal silicon surfaces.

Paper Details

Date Published: 10 June 2006
PDF: 6 pages
Proc. SPIE 6344, Advanced Laser Technologies 2005, 63441M (10 June 2006); doi: 10.1117/12.694415
Show Author Affiliations
F. Z. Fang, Tianjin Univ. (China)
Y. C. Liu, Singapore Institute of Manufacturing Technology (Singapore)


Published in SPIE Proceedings Vol. 6344:
Advanced Laser Technologies 2005
Ivan A. Shcherbakov; Kexin Xu; Qingyue Wang; Alexander V. Priezzhev; Vladimir I. Pustovoy, Editor(s)

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