Share Email Print
cover

Proceedings Paper

Analytic and laser vibrometry study of squeeze film damping of MEMS cantilevers
Author(s): Joseph F. Vignola; John A. Judge; Eric Lawrence; Jacek Jarzynski; Brian Houston
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

This study compares theoretical predictions to experimental measurements of squeeze film damping of MEMS cantilevers in a fluid environment. A series of MEMS cantilevers were fabricated on a silicon wafer. Each of the silicon beams was 2 μm thick and 18 μm wide. The lengths range from 100 to 800 μm and the air-filled gap between the cantilever and the substrate was 6 μm. An analytic model for squeeze film damping was used to predict the corresponding quality factor Qsqueeze film (the ratio of the mechanical energy stored in the oscillator to the energy dissipated per cycle) for these cantilevers. The results from the modeling are compared to experimental results obtained using a Polytec MSA-400 Micro System Analyzer.

Paper Details

Date Published: 21 June 2006
PDF: 8 pages
Proc. SPIE 6345, Seventh International Conference on Vibration Measurements by Laser Techniques: Advances and Applications, 63451C (21 June 2006); doi: 10.1117/12.693065
Show Author Affiliations
Joseph F. Vignola, U.S. Naval Research Lab. (United States)
John A. Judge, The Catholic Univ. of America (United States)
Eric Lawrence, Polytec, Inc. (United States)
Jacek Jarzynski, U.S. Naval Research Lab. (United States)
SFA (United States)
Brian Houston, U.S. Naval Research Lab. (United States)


Published in SPIE Proceedings Vol. 6345:
Seventh International Conference on Vibration Measurements by Laser Techniques: Advances and Applications
Enrico Primo Tomasini, Editor(s)

© SPIE. Terms of Use
Back to Top