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Proceedings Paper

Application challenges with double patterning technology (DPT) beyond 45 nm
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Paper Abstract

Double patterning technology (DPT) is a promising technique that bridges the anticipated technology gap from the use of 193nm immersion to EUV for the half-pitch device node beyond 45nm. The intended mask pattern is formed by two independent patterning steps. Using DPT, there is no optical imaging correlation between the two separate patterning steps except for the impact from mask overlay. In each of the single exposure step, we can relax the dense design pattern pitches by decomposing them into two half-dense ones. This allows a higher k1 imaging factor for each patterning step. With combined patterns, we can achieve overall k1 factor that exceeds the conventional Rayleigh resolution limit. This paper addresses DPT application challenges with respect to both mask error factor (MEF) and 2D patterning. In our simulations using DPT with relaxed feature pitch for each exposure step, the MEF for the line/space is fairly manageable for 32nm half-pitch and below. The real challenge for the 32nm half-pitch and below with DPT is how to deal with the printing of small 2D features resulting from the many cutting sites due to feature decomposition. Each split of a dense pattern generates two difficult-to-print line-end type features with dimension less than one-fifth or one-sixth of ArF wavelength. Worse, the proximity environment of the 2D cut features can then become quite complex. How to stitch them correctly back to the original target requires careful attention. Applying target bias can improve the printing performance in general. But using a model-based stitching error correction method seems to be a preferred solution.

Paper Details

Date Published: 20 October 2006
PDF: 12 pages
Proc. SPIE 6349, Photomask Technology 2006, 634922 (20 October 2006); doi: 10.1117/12.692921
Show Author Affiliations
Jungchul Park, ASML MaskTools (United States)
Stephen Hsu, ASML MaskTools (United States)
Douglas Van Den Broeke, ASML MaskTools (United States)
J. Fung Chen, ASML MaskTools (United States)
Mircea Dusa, ASML Technology Development Ctr. (United States)
Robert Socha, ASML Technology Development Ctr. (United States)
Jo Finders, ASML Netherlands B.V. (Netherlands)
Bert Vleeming, ASML Netherlands B.V. (Netherlands)
Anton van Oosten, ASML Netherlands B.V. (Netherlands)
Peter Nikolsky, ASML Netherlands B.V. (Netherlands)
Vincent Wiaux, IMEC vzw (Belgium)
Eric Hendrickx, IMEC vzw (Belgium)
Joost Bekaert, IMEC vzw (Belgium)
Geert Vandenberghe, IMEC vzw (Belgium)

Published in SPIE Proceedings Vol. 6349:
Photomask Technology 2006
Patrick M. Martin; Robert J. Naber, Editor(s)

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