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Proceedings Paper

Plasma deposited and evaporated thin resists for template fabrication
Author(s): Eric Lavallée; Jacques Beauvais; Bertrand Takam Mangoua; Dominique Drouin
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Paper Abstract

In this paper, we demonstrate electron beam lithography at energies ranging from 2 keV to 100 keV, on sub-100 nm thick resists. Such uniform and thin electron beam sensitive films can be deposited by evaporation or by plasma deposition. Two examples of such resists are studied, QSR-5 which is a negative sterol based evaporated resist and QPR-P50 which is a positive PECVD deposited fluoropolymer resist. AFM measurements demonstrate surface roughness smaller then 3 nm for QSR-5 and 0.7 nm for QPR-P50. In both cases, 50 nm features or better are patterned using electron beam lithography on a template blank consisting of a glass substrate, coated with a 10 nm thick Cr transfer layer and a resist layer. LER (3σ) is measured to be less then 8% for 50 nm wide lines in QSR-5 and of approx. 10% for 50 nm wide lines in QPR-P50.

Paper Details

Date Published: 21 June 2006
PDF: 6 pages
Proc. SPIE 6281, 22nd European Mask and Lithography Conference, 62810O (21 June 2006); doi: 10.1117/12.692742
Show Author Affiliations
Eric Lavallée, Quantiscript Inc. (Canada)
Jacques Beauvais, Quantiscript Inc. (Canada)
Bertrand Takam Mangoua, Quantiscript Inc. (Canada)
Dominique Drouin, Quantiscript Inc. (Canada)


Published in SPIE Proceedings Vol. 6281:
22nd European Mask and Lithography Conference
Uwe F. W. Behringer, Editor(s)

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