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Proceedings Paper

Advanced processes for photomask damage-free cleaning and photoresist removal
Author(s): James S. Papanu; Roman Gouk; Han-Wen Chen; Pieter Boelen; Phillip Peters; Michael Belisle; Steven Verhaverbeke; Alexander Ko; Kent Child; Elias Martinez
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Paper Abstract

Photon induced haze resulting from sulfur residues that remain after cleaning and photoresist stripping is a key challenge for 193 nm photomasks. In previously reported work, sulfur-free processes for cleaning and photoresist removal on mask blanks were shown. Additional characterization and development of the cleaning and strip/clean processes are presented here. For cleaning the particle adder stability, ammonia chemistry residue levels, and chrome oxide anti-reflection coating (ARC) layer integrity were characterized. It was found that process modification was needed to provide acceptable post-clean ammonia levels and reflectivity change per clean. A strip/clean process with acceptable window for complete resist removal without ARC layer damage was found to be challenging and dependent on the mask photoresist/ARC stack. Dry strip, wet strip, and combined dry/wet stripping approaches (all followed by wet clean) were investigated. Oxidizing dry strip chemistry, while easily removing the bulk photoresist layer, gave unacceptable ARC attack. For FEP photoresist an all-wet process was demonstrated, and for iP and NEB resists, promising results were achieved with less oxidizing dry strip chemistry.

Paper Details

Date Published: 21 June 2006
PDF: 11 pages
Proc. SPIE 6281, 22nd European Mask and Lithography Conference, 62810K (21 June 2006); doi: 10.1117/12.692644
Show Author Affiliations
James S. Papanu, Applied Materials (United States)
Roman Gouk, Applied Materials (United States)
Han-Wen Chen, Applied Materials (United States)
Pieter Boelen, Applied Materials (United States)
Phillip Peters, Applied Materials (United States)
Michael Belisle, Applied Materials (United States)
Steven Verhaverbeke, Applied Materials (United States)
Alexander Ko, Applied Materials (United States)
Kent Child, Applied Materials (United States)
Elias Martinez, Applied Materials (United States)


Published in SPIE Proceedings Vol. 6281:
22nd European Mask and Lithography Conference

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