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Proceedings Paper

Data prep: the bottleneck of future applications?
Author(s): Juergen Gramss; Hans Eichhorn; Melchior Lempke; Renate Jaritz; Volker Neick; Dirk Beyer; Bertram Buerger; Ulrich Baetz; Klaus Kunze; Nikola Belic
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Paper Abstract

There is no doubt that shaped beam systems have been well established in the mask write community since the introduction of the 130nm technology node. Moreover, they are successfully advancing to conquer also the wafer direct write market. To be able to handle today and in the near future the tremendous data volumes with their characteristic complexity as well as to make use of such indispensable methods like PEC and Fogging corrections, new, sophisticated solutions are necessary to master the challenging 45nm technology node. However, we are aware that the 45nm node presents only an intermediate step, because, according to the international roadmap, we soon will be confronted with the hardware and software requirements of the next, the 32nm technology node. In this context it becomes more and more important to consider potential showstoppers, in our case the data preparation process To investigate this complex subject a Linux cluster computer featuring 3.6GHz clock rate CPUs, and a software package supporting distributed computing with a 64Bit version and address units down to 0.1nm were used. The work was focused on the performance of pattern samples down to the 45nm node. Both mask and wafer data as well as NIL template manufacturing were considered, data prep times and CPU loads were analysed. Furthermore, the user-friendly Leica Interface for Data Preparations (LINDA) was applied. In addition, an outlook to future hardware/software configurations for mastering the challenges of the 32nm node will be given. The results presented in this paper prove that data preparation is not the bottleneck of current and future applications.

Paper Details

Date Published: 21 June 2006
PDF: 12 pages
Proc. SPIE 6281, 22nd European Mask and Lithography Conference, 62810G (21 June 2006); doi: 10.1117/12.692638
Show Author Affiliations
Juergen Gramss, Leica Microsystems Lithography GmbH (Germany)
Hans Eichhorn, Leica Microsystems Lithography GmbH (Germany)
Melchior Lempke, Leica Microsystems Lithography GmbH (Germany)
Renate Jaritz, Leica Microsystems Lithography GmbH (Germany)
Volker Neick, Leica Microsystems Lithography GmbH (Germany)
Dirk Beyer, Leica Microsystems Lithography GmbH (Germany)
Bertram Buerger, Fraunhofer IPMS (Germany)
Ulrich Baetz, Fraunhofer IPMS (Germany)
Klaus Kunze, Fraunhofer IPMS (Germany)
Nikola Belic, PDF Solutions GmbH (Germany)


Published in SPIE Proceedings Vol. 6281:
22nd European Mask and Lithography Conference
Uwe F. W. Behringer, Editor(s)

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