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Proceedings Paper

Multi-project reticle design and wafer dicing under uncertain demand
Author(s): Andrew B. Kahng; Ion Măndoiu; Xu Xu; Alexander Z. Zelikovsky
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Paper Abstract

The pervasive use of advanced reticle enhancement technologies demanded by VLSI technology scaling leads to dramatic increases in mask costs. In response to this trend, multiple project wafers (MPW) have been proposed as an effective technique for sharing the cost of mask tooling among up to tens of prototype and low volume designs. Previous works on MPW reticle design and dicing have focused on the simple scenario in which production volumes are known a priori. However, this scenario does not apply for low- and medium-volume production, in which mask manufacturing is typically started when only rough estimates of future customer demands are available. In this paper we initiate the study of MPW use for production under demand uncertainty and propose efficient algorithms for two main optimizations that arise in this context: reticle design under demand uncertainty and on-demand wafer dicing. Preliminary experiments on simulated data show that our methods help reducing the cost overheads incurred by demand uncertainty, yielding solutions with a cost close to that achievable when a priori knowledge of production volumes is available.

Paper Details

Date Published: 27 June 2006
PDF: 11 pages
Proc. SPIE 6281, 22nd European Mask and Lithography Conference, 628104 (27 June 2006); doi: 10.1117/12.692627
Show Author Affiliations
Andrew B. Kahng, Univ. of California, San Diego (United States)
Ion Măndoiu, Univ. of Connecticut (United States)
Xu Xu, Univ. of California, San Diego (United States)
Alexander Z. Zelikovsky, Georgia State Univ. (United States)


Published in SPIE Proceedings Vol. 6281:
22nd European Mask and Lithography Conference
Uwe F. W. Behringer, Editor(s)

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