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Proceedings Paper

Thermal simulation studies of high-power light-emitting diodes
Author(s): B. F. Fan; Y. Zhao; Y. L. Xian; G. Wang
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Paper Abstract

We showed a detailed thermal simulation of an Epi-down flip-chip packaged LED. Simulation results show that chip attachment defects can cause significant thermal gradients across the active layer of chip, leading to premature failures.

Paper Details

Date Published: 21 September 2006
PDF: 4 pages
Proc. SPIE 6355, Advanced LEDs for Solid State Lighting, 63550D (21 September 2006); doi: 10.1117/12.691605
Show Author Affiliations
B. F. Fan, Sun Yat-sen Univ. (China)
Y. Zhao, Sun Yat-sen Univ. (China)
Y. L. Xian, Sun Yat-sen Univ. (China)
G. Wang, Sun Yat-sen Univ. (China)

Published in SPIE Proceedings Vol. 6355:
Advanced LEDs for Solid State Lighting
Chang-Hee Hong; Tsunemasa Taguchi; Jung Han; Lianghui Chen, Editor(s)

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