Share Email Print
cover

Proceedings Paper

Fiber alignment analysis of a receiver with integrated MEMS VOA
Author(s): Chao Wang; Ryan Hickey; Rob Irwin; Ming Li; Zhengxuan Wang
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

The structure of the optical path of a novel VOA integrated receiver is presented. The method to enhance the attenuation performance of the Receiver is described in detail. The standard coplanar package module exhibits a fluent attenuation curve and can achieve more than -20dB attenuation at ~ 6.5V drive voltage. S21, S22 performance and specifications of the module are explained in the paper. All these features provide customers considerable benefits, including high quality, low power consumption and cost, board real estate flexibility and ease of use.

Paper Details

Date Published: 6 October 2006
PDF: 8 pages
Proc. SPIE 6352, Optoelectronic Materials and Devices, 63521Q (6 October 2006); doi: 10.1117/12.688522
Show Author Affiliations
Chao Wang, Bookham Technology Co. Ltd. (China)
Ryan Hickey, Bookham Inc. (Canada)
Rob Irwin, Bookham Technology plc (United Kingdom)
Ming Li, Bookham Technology Co. Ltd. (China)
Zhengxuan Wang, Bookham Technology Co. Ltd. (China)


Published in SPIE Proceedings Vol. 6352:
Optoelectronic Materials and Devices
Yong Hee Lee; Fumio Koyama; Yi Luo, Editor(s)

© SPIE. Terms of Use
Back to Top