Share Email Print
cover

Proceedings Paper

Highly integrated 10Gb/s optical sub-assembly and its circuit modeling
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

A highly integrated 10 Gb/s transmitter optical sub-assembly was fabricated and characterized for XFP transceiver. As a light source, uncooled 1.3 μm high-speed distributed feedback laser diode (DFB-LD) was fabricated and assembled on AlN sub-mount with a monitoring PD, a matching-resistor, and a bias-Tee with spiral-inductor. A glass sealed metallic low-loss TO-stem with in-line leads was newly presented. We developed a small-signal equivalent circuit model based on measured S-parameters in order to verify RF characteristics of LD and passive components. The eye-diagram of 10 Gb/s NRZ patterns with a PRBS 231 -1 was opened clearly without mask violation. At 85°C, -3-dB bandwidth was measured as high as 11 GHz and 75-km transmission was successfully achieved with very low penalty.

Paper Details

Date Published: 5 October 2006
PDF: 8 pages
Proc. SPIE 6352, Optoelectronic Materials and Devices, 63520D (5 October 2006); doi: 10.1117/12.687391
Show Author Affiliations
Jongin Shim, Hanyang Univ. (South Korea)
Dongchurl Kim, Hanyang Univ. (South Korea)


Published in SPIE Proceedings Vol. 6352:
Optoelectronic Materials and Devices
Yong Hee Lee; Fumio Koyama; Yi Luo, Editor(s)

© SPIE. Terms of Use
Back to Top