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Proceedings Paper

Integration of optical isolators and semiconductor lasers by wafer bonding
Author(s): Tetsuya Mizumoto; Kazumasa Sakurai; Yuya Shoji; Hideki Saito
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Paper Abstract

We developed a technique of bonding magneto-optic garnets to III/V compound semiconductors for integrating an optical isolator with a semiconductor optical device. Some approaches to realize an isolator integrated with a laser diode will be presented.

Paper Details

Date Published: 6 October 2006
PDF: 8 pages
Proc. SPIE 6352, Optoelectronic Materials and Devices, 63522B (6 October 2006); doi: 10.1117/12.687371
Show Author Affiliations
Tetsuya Mizumoto, Tokyo Institute of Technology (Japan)
JST-CREST (Japan)
Kazumasa Sakurai, Tokyo Institute of Technology (Japan)
Yuya Shoji, Tokyo Institute of Technology (Japan)
Hideki Saito, Tokyo Institute of Technology (Japan)


Published in SPIE Proceedings Vol. 6352:
Optoelectronic Materials and Devices
Yong Hee Lee; Fumio Koyama; Yi Luo, Editor(s)

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