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Proceedings Paper

Intelligent force control of a microchip packaging system
Author(s): Jae Hong Shim; Young-Im Cho
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Paper Abstract

In this paper, we developed a new mounting head system for a microchip such as flip chip. The proposed head system consists of a macro/micro positioning actuator for stable force control. The macro actuator provide the system with a gross motion while the micro device yields fine tuned motion to reduce the harmful impact force that occurs between very small sized electronic parts and the surface of a PCB(printed circuit board). In order to show the effectiveness of the proposed macro/micro mounting system, we compared the proposed system with the conventional mounting head equipped with a macro actuator only. A series of experiments were executed under the mounting conditions such as various access velocities and PCB stiffness. As a result of this study, a satisfactory voice coil actuator as the micro actuator has been developed , and its performance meet well the specifications desired for the design of the microchip mounting head system and show good correspondence between theoretical analysis and experimental results.

Paper Details

Date Published: 13 October 2006
PDF: 11 pages
Proc. SPIE 6376, Optomechatronic Micro/Nano Devices and Components II, 63760A (13 October 2006); doi: 10.1117/12.687304
Show Author Affiliations
Jae Hong Shim, Korea Polytechnic Univ. (South Korea)
Young-Im Cho, Univ. of Suwon (South Korea)


Published in SPIE Proceedings Vol. 6376:
Optomechatronic Micro/Nano Devices and Components II
Yoshitada Katagiri, Editor(s)

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