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Proceedings Paper

Multilayer defects nucleated by substrate pits: a comparison of actinic inspection and non-actinic inspection techniques
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Paper Abstract

The production of defect-free mask blanks remains a key challenge for EUV lithography. Mask-blank inspection tools must be able to accurately detect all critical defects whilst simultaneously having the minimum possible false-positive detection rate. We have recently observed and here report the identification of bump-type buried substrate defects, that were below the detection limit of a non-actinic (i.e. non-EUV) inspection tool. Presently, the occurrence of pit-type defects, their printability, and their detectability with actinic techniques and non-actinic commercial tools, has become a significant concern. We believe that the most successful strategy for the development of effective non-actinic mask inspection tools will involve the careful cross-correlation with actinic inspection and lithographic printing. In this way, the true efficacy of prototype inspection tools now under development can be studied quantitatively against relevant benchmarks. To this end we have developed a dual-mode actinic mask inspection system capable of scanning mask blanks for defects (with simultaneous EUV bright-field and dark-field detection) and imaging those same defects with a zoneplate microscope that matches or exceeds the resolution of EUV steppers.

Paper Details

Date Published: 20 October 2006
PDF: 9 pages
Proc. SPIE 6349, Photomask Technology 2006, 63492M (20 October 2006); doi: 10.1117/12.686742
Show Author Affiliations
A. Barty, Lawrence Livermore National Lab. (United States)
K. A. Goldberg, Lawrence Berkeley National Lab. (United States)
P. Kearney, Sematch, Inc. (United States)
S. B. Rekawa, Lawrence Berkeley National Lab. (United States)
B. LaFontaine, Advanced Micro Devices, Inc. (United States)
O. Wood, Sematech, Inc. (United States)
J. S. Taylor, Lawrence Livermore National Lab. (United States)
H.-S. Han, Sematech, Inc. (United States)


Published in SPIE Proceedings Vol. 6349:
Photomask Technology 2006
Patrick M. Martin; Robert J. Naber, Editor(s)

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