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Proceedings Paper

Metrics to assess fracture quality for variable shaped beam lithography
Author(s): M. Bloecker; R. Gladhill; P. D. Buck; M. Kempf; D. Aguilar; R. B. Cinque
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Paper Abstract

CD control requirements for advanced node masks are in the low single digit nanometer range. CD control for Variable Shaped Beam (VSB) lithography that is used to manufacture these masks is dependent on the post-fracture figure layout. Shot linearity, shot size repeatability, and shot placement repeatability can affect CD control differently based on the figure layout. The potential CD error contribution from poorly optimized fracture strategies thus can be a significant contributor to the total CD error. In this paper we present a set of fracture quality metrics based on the impact on mask CD control and methods using EDA software to grade fracture strategies based on these fracture quality metrics. We also discuss applications of this metric for fracture tool design and the implementation of different fracture strategies into mask manufacturing including examinations of the predictability of fracturing results. Finally, we will discuss the usage of existing information about the design (such as design intent) in conjunction with the proposed quality metrics to judge different fracture strategies.

Paper Details

Date Published: 20 October 2006
PDF: 10 pages
Proc. SPIE 6349, Photomask Technology 2006, 63490Z (20 October 2006); doi: 10.1117/12.686713
Show Author Affiliations
M. Bloecker, Advanced Mask Technology Ctr. (Germany)
R. Gladhill, Toppan Photomasks, Inc. (United States)
P. D. Buck, Toppan Photomasks, Inc. (United States)
M. Kempf, Advanced Mask Technology Ctr. (Germany)
D. Aguilar, Toppan Photomasks, Inc. (United States)
R. B. Cinque, Advanced Mask Technology Ctr. (Germany)


Published in SPIE Proceedings Vol. 6349:
Photomask Technology 2006
Patrick M. Martin; Robert J. Naber, Editor(s)

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