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Proceedings Paper

EUV mask pattern inspection for memory mask fabrication in 45-nm node and below
Author(s): Do Young Kim; Seong Yong Cho; Hun Kim; Sung Min Huh; Dong Hoon Chung; Byung Chul Cha; Jung Woo Lee; Seong Woon Choi; Woo Sung Han; Ki Hun Park; Eun Ji Kim; Zhengyu Guo; Ellen Quach; David Gee; Tom Brown; Aditya Dayal
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Paper Abstract

As the design rule continues to shrink towards 45 nm node and beyond, the lithographers need the new technologies such as immersion lithography and EUV lithography. Also the inspection specification on the printed reticle defects is becoming even more challenging for the reticles used in both lithography methods. The main purpose of this study is to investigate the pattern defect detection capability on EUV mask with the memory design patterns of 45 nm node and below in the DUV reticle inspection systems at our mask-shop and to compare those results with the absorber defect specification from the EUV lithography simulation in those design rules. In addition, we investigate the inspection capability on the pattern defects with the test optical mask designed in 45 nm node and below for the immersion lithography and compare the defect detection ability on the EUV mask and the optical mask in the current DUV reticle inspection equipment.

Paper Details

Date Published: 20 October 2006
PDF: 10 pages
Proc. SPIE 6349, Photomask Technology 2006, 63492L (20 October 2006); doi: 10.1117/12.686488
Show Author Affiliations
Do Young Kim, Samsung Electronics Co., Ltd. (South Korea)
Seong Yong Cho, Samsung Electronics Co., Ltd. (South Korea)
Hun Kim, Samsung Electronics Co., Ltd. (South Korea)
Sung Min Huh, Samsung Electronics Co., Ltd. (South Korea)
Dong Hoon Chung, Samsung Electronics Co., Ltd. (South Korea)
Byung Chul Cha, Samsung Electronics Co., Ltd. (South Korea)
Jung Woo Lee, Samsung Electronics Co., Ltd. (South Korea)
Seong Woon Choi, Samsung Electronics Co., Ltd. (South Korea)
Woo Sung Han, Samsung Electronics Co., Ltd. (South Korea)
Ki Hun Park, KLA-Tencor Corp. (United States)
Eun Ji Kim, KLA-Tencor Corp. (United States)
Zhengyu Guo, KLA-Tencor Corp. (United States)
Ellen Quach, KLA-Tencor Corp. (United States)
David Gee, KLA-Tencor Corp. (United States)
Tom Brown, KLA-Tencor Corp. (United States)
Aditya Dayal, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 6349:
Photomask Technology 2006
Patrick M. Martin; Robert J. Naber, Editor(s)

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